Infineon Launches Advanced AIROC™ CYW5591x MCU Family for Next-Gen IoT Devices
(IN BRIEF) Infineon Technologies AG has launched the AIROC™ CYW5591x Connected Microcontroller (MCU) product family, featuring Wi-Fi 6/6E and Bluetooth® Low Energy 5.4, to create efficient and compact IoT devices. This new MCU family supports rapid development with Infineon’s ModusToolbox™ software and other tools. Key partners like AzureWave, Murata, and USI have praised the new products for their ability to simplify wireless development and enhance connectivity for smart home, industrial, and wearable applications. The MCUs are currently being sampled by alpha customers.
(PRESS RELEASE) MUNICH, 24-Jun-2024 — /EuropaWire/ — Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY), a German semiconductor manufacturer, announces that it has unveiled its new AIROC™ CYW5591x Connected Microcontroller (MCU) product family, which features advanced Wi-Fi 6/6E and Bluetooth® Low Energy 5.4 capabilities. These MCUs are designed to enable the creation of cost-effective, energy-efficient, and compact smart home, industrial, wearable, and IoT devices. The product family is supported by Infineon’s ModusToolbox™ software, RTOS and Linux host drivers, a validated Bluetooth stack, sample code examples, and Matter software enablement, accelerating customers’ time-to-market.
Sivaram Trikutam, Vice President of Wi-Fi Products at Infineon Technologies, emphasized the company’s commitment to low-power IoT solutions: “As an IoT leader with more than a billion Wi-Fi devices deployed worldwide, Infineon is committed to driving decarbonization and digitalization with low-power solutions that connect products to the cloud. Our new AIROC CYW5591x Connected MCU family combines industry-leading wireless performance with low power consumption, enabling best-in-class IoT products.”
The AIROC™ CYW5591x family includes three versions: CYW55913 (tri-band), CYW55912 (dual-band), and CYW55911 (single-band), offering flexibility for various IoT applications. Key features include an Arm® Cortex® M33 192MHz MCU, robust security measures, extensive peripheral and GPIO support, and high Wi-Fi and Bluetooth performance.
Infineon’s CYW55913/2/1 MCUs are currently being sampled by alpha customers. Interested parties can contact CYW5591x-ContactUs@infineon.com for more information.
AzureWave: Patrick Lin, Vice President at AzureWave, expressed enthusiasm for the partnership: “Our new ultra-small wireless modules with Infineon’s secured and robust components deliver seamless connectivity for personal and industrial devices, supporting the smart, connected requirements of tomorrow.”
Murata: Masatomo Hashimoto, Director of the Communication Module Division at Murata, highlighted the benefits of Infineon’s new products: “Our latest Wi-Fi modules with Infineon’s Wi-Fi 6 SoC simplify wireless development and certification, bringing seamless connectivity to a variety of smart, connected devices.”
USI: Mason Lin, Senior Vice President and GM of Advanced Mobile and Miniaturization BG at USI, noted the advantages for developers: “Infineon’s new chips in our miniaturized Wi-Fi/BT combo modules expedite time-to-market, empowering developers to swiftly introduce portable consumer, smart home, and industrial applications.”
Infineon’s extensive module and platform partner ecosystem ensures tailored solutions to meet specific application requirements, reinforcing its position as a leader in the IoT sector.
About Infineon
Infineon Technologies AG is a global semiconductor leader in power systems and IoT. Infineon drives decarbonization and digitalization with its products and solutions. The company has around 58,600 employees worldwide and generated revenue of about €16.3 billion in the 2023 fiscal year (ending 30 September). Infineon is listed on the Frankfurt Stock Exchange (ticker symbol: IFX) and in the USA on the OTCQX International over-the-counter market (ticker symbol: IFNNY).
———-
First published in this link of EuropaWIRE.
